Temperature-Control Technology for Optical Communication Modules Based on Micro-Thermoelectric Cooler
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Abstract
Micro-thermoelectric cooler (Micro-TEC) is a semiconductor thermoelectric conversion device based on the Peltier effect and can provide localized temperature control for temperature-sensitive devices. With the rapid development of electronic information industries and the increasing integration density of semiconductor devices, key parameters of optical communication modules have become highly sensitive to temperature variations, directly influencing optical and electromagnetic signal transmission quality. This work proposes an active temperature-control technology for optical communication modules based on Micro-TEC. Design parameters are derived from the thermoelectric cooling model, and high-strength Bi2Te3-based thermoelectric materials are prepared by hot extrusion. The thermoelectric performance of hot-extruded Bi2Te3 is improved through halogen-compound doping and solid-solution composition regulation. By integrating surface treatment, particle fabrication, assembly integration, and overall soldering processes, a practical fabrication method for Micro-TEC is developed. At 300 K, the measured maximum temperature difference reaches 69.53 K, and the Bi2Te3 particle integration density exceeds 1000 particles/cm2. Application verification in an optical module confirms effective photonic-chip temperature control, showing potential in communications, lasers, infrared systems, optics, and electromagnetic signal-stability applications.
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